Operator

Requirements

1. High school diploma or above; ability to learn.

2. Experience in semiconductor packaging and testing, electronics assembly, or instruments; familiarity with front-end chip packaging processes (die bond or wire bond) preferred.

3. Strong hands-on ability, good eyesight, and able to work under a microscope.

4. Comply with company rules and regulations, follow management arrangements, and adapt to overtime.

5. Self-motivated, responsible and clear-thinking; hardworking and able to endure hardship.

6. Willing to grow with the company long-term; strong long-term stability.

Contact
Contact: Mr. Xiang / Ms. Sun
Email: hr@smartstone-tech.com
Tel: 021-69223202-801